Job Description
● Design and develop lead-frame and substrate laminate packages
● Perform package layout design, lead-frame drafting, and wire bonding scheme development
● Collaborate closely with suppliers and cross-functional engineering teams
● Deliver manufacturable, high-quality package designs using industry-standard CAD tools
● Maintain accurate design documentation and reporting
Requirements
● Minimum 5 years of experience in package design engineering.
● Proven experience in lead-frame and/or substrate laminate package design
● Hands-on experience in package layout design, lead-frame drafting, and wire bonding schemes
● Proficiency in AutoCAD for lead-frame design and drafting
● Experience with Cadence tools for substrate laminate package design
● Experience working with lead-frame and/or substrate suppliers
● Strong communication, collaboration, and documentation skills
● Familiarity with emerging semiconductor packaging technologies is an advantage
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